Effective packaging of racked electronic systems involving multiple printed circuit boards and complex heat transfer challenges demands the expertise of a company like the POLYRACK Tech-Group. The German manufacturer is a leading provider of integrated packaging solutions for the electronics industry. POLYRACK offers a range of products and services, including enclosures, 19-inch subracks, microcomputer packaging systems (MPS), industrial PC applications, and backplanes, as well as custom-tailored parts and solutions.
Optimise electronics cooling and innovate effective cooling system designs for racked electronic systems and components.
Implement SOLIDWORKS Flow Simulation CFD analysis software along with its Electronics Cooling Module to simulate heat transfer behavior in electronic systems.
- Reduced development time from three months to two weeks
- Cut two prototyping cycles
- Generated new flow simulation consulting business
- Innovated new approaches to electronics cooling system design
"SOLIDWORKS Flow Simulation not only improves our productivity and efficiency, but also lets us tackle heat transfer challenges that we would not be able to resolve without it."